上海国际数字印刷设备技术博览会
April 8-10, 2025
Shanghai New International Expo Centre, Shanghai, China

A Resounding Conclusion! A Letter of Thanks to All Our Attendees!

Distinguished enterprises, industry guests, media friends, and visitors from all walks of life,

 

Greetings!


I would like to extend our heartfelt gratitude for your contributions to the WEPACK World Packaging Industry Expo held from July 12th to July 14th, 2023 at the National Exhibition and Convention Center (Shanghai). The exhibition not only facilitated new commerce and exchange, but also boosted confidence in the future of our industry. Thanks to your support, the exhibition finished strong!

Exceeding Expectations and Inspiring Achievement
From preparation and planning to organization and implementation, this extraordinary event was only possible through the trust and support of all our participants, media representatives, partners, and exhibitors, from both home and abroad. Six themed exhibitions (SinoCorrugated 2023, SinoFoldingCarton 2023, DPrint 2023, SinoPaper 2023, FOOD PACK & TECH 2023 and PACKCON 2023) convened simultaneously, welcoming 1,200+ brand exhibitors and covering an exhibition area exceeding 100,000 m2 for the first time.

Your One-Stop Shop for the Packaging Industry


The exhibition showcased materials, new product releases, and technologies from all stages of the industry supply chain, including carton products, folding carton packaging equipment and processing technologies, raw paper materials, and digitally-printed packaging. Visitors were enticed by paper, plastic, and metal packaging products; cutting-edge technologies; innovative industry solutions; and food and beverage packaging displays. 

20+ Informative Forums


A key supplement to the exhibition, WEPACK World Packaging Industry Exhibition also offered 20+ summit forums. New product releases and signing ceremonies electrified the atmosphere, while in-person exchanges between different industry experts and professionals left attendees invigorated with new ideas and opportunities. 

Themed forums such as the World Corrugated Forum (WCF), World Corrugated Awards (WCA), Southeast Asia Day, India National Day, China Paper Packaging Digital and Intelligent Manufacturing Summit, Digital and Intelligent Green Packaging Development Forum, China Pulp and Paper Market Supply and Demand Trend Seminar, New Product Release of Paper Mills and Paper Industry Summit Forum, The 6th China Alcoholic Drink Packaging Process Integration and Innovation Forum, and Summit Forum on Development Trends of Digital Printing in Packaging Market, held discussions on trending industry topics. Enterprises and audience members were exposed to unique perspectives on various industry development trends. 

Thank You Again! We Look Forward to Seeing You Next Year!
A new tomorrow, a new future, and a new era! The next edition of the WEPACK World Packaging Industry Expo, held April 10th-12th, 2024 at Shenzhen World Exhibition & Convention Center (Bao'an New Hall), will be bigger and more advanced. Exhibition systems and services will set the standard for the industry, offering an unparalleled exhibition experience for our friends and visitors. Once again, thank you for your attendance and support! We pledge to continue collaboration with our partners to bolster the industry's development and innovation!